Simulation of Via Interconnects using Physics-Based Models and Microwave Network Parameters


In this paper, the simulation of via interconnects in multilayered printed circuit boards (PCBs) and packages combining physics-based via models and microwave network theory will be discussed. The description of the via in terms of network parameters, partitioning of the system, and combination of partial results will be addressed. Two alternatives to combine the results are compared, namely multiplication of ABCD matrices and the segmentation method based on S-parameters. The goal of this work is to develop a fast and accurate modeling strategy for via arrays in the multi-Gigabit range, extensible to an arbitrary number of elements, and suitable for automation and design optimization. The obtained results show good agreement with respect to 3D electromagnetic field simulations and measurements up to 20 GHz. Hence, this approach is a promising technique for efficient system-level simulation of interconnects.

Meeting Name

12th IEEE Workshop on Signal Propagation on Interconnects (2008: May 12-15, Avignon, France)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Circuit Theory; Crack Propagation; Electric Fields; Electromagnetic Field Theory; Electromagnetic Fields; Electromagnetism; Electronic Equipment Manufacture; Information Theory; Interchanges; Magnetic Fields; Microwaves; Optimization; Polychlorinated Biphenyls; Printed Circuit Manufacture; Printed Circuits; Three Dimensional; Accurate Modeling; Arbitrary Numbers; Design Optimization; Field Simulations; Multi-Layered; Network Parameters; Network Theory; Partial Results; Physics-Based Modelling; Promising Technique; S-Parameters; Segmentation Methods; Signal Propagation; System-Level Simulations; Printed Circuit Boards

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2008