Signal Integrity: Efficient, Physics-Based Via Modeling: Integration of Striplines
In the first article of this series, principles and methods of physics-based via modeling were discussed. It was shown how the electromagnetic behavior of vias can be captured by an equivalent circuit based modeling approach that describes all relevant full-wave effects. In this follow-up article, the authors present an approach to integrate striplines into the physics-based via model. The striplines can be located at any layer of the stackup and they may constitute both single and multiconductor transmission lines. The integration of striplines extends the via representation to a full, efficient interconnect model of, for instance, printed circuit board signal links. An intuitive integration approach at a circuit simulator level and application examples are discussed in this article as well.
R. Rimolo-Donadio et al., "Signal Integrity: Efficient, Physics-Based Via Modeling: Integration of Striplines," IEEE Electromagnetic Compatibility Magazine, vol. 1, no. 2, pp. 74 - 81, Institute of Electrical and Electronics Engineers (IEEE), Jun 2012.
The definitive version is available at https://doi.org/10.1109/MEMC.2012.6244976
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electric Lines; Integration; Printed Circuits; Strip Telecommunication Lines; Parallel Plates; Power Distribution Network; Power Integrity; Trace Models; Printed Circuit Boards; Parallel Plates; Physics-Based; Printed Circuit Board; Signal And Power Integrity; Via And Trace Model; Impedance; Integrated Circuit Modeling; Electromagnetic Compatibility; Cavity Resonators; Computational Modeling; Strip Lines; Equivalent Circuits; High-Frequency Transmission Lines; Integrated Circuit Interconnections
International Standard Serial Number (ISSN)
Article - Journal
© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Jun 2012