Physics-Based Via Model Development and Verification
Vias are widely modeled and investigated as they are one of the most concerns for the critical signal nets in high-speed digital systems. 3-D full-wave modelling can predict the electrical performance of a via accurately with correct model settings, which are related to the understood of the physics behind the signal transition and the wave propagation associated with the via. This paper will detail physics-based via model development by tracking the current path and mapping the via structures to circuit components/blocks where the peeling and partitioning method is used to decompose the entire via structure into via blocks. A simple via structure with the signal transitions from a microstrip to a microstrip is studied as an example. Good agreement has been achieved between the physics-based via simulation and the full-wave modeling in the frequency-domain with S-parameters and in the time-domain with eye-height and eye-width at different data rates.
J. Zhang et al., "Physics-Based Via Model Development and Verification," Proceedings of the Asia-Pacific Symposium on Electromagnetic Compatibility (2010, Beijing, China), pp. 1043 - 1046, Institute of Electrical and Electronics Engineers (IEEE), Apr 2010.
The definitive version is available at https://doi.org/10.1109/APEMC.2010.5475507
Asia-Pacific Symposium on Electromagnetic Compatibilty (2010: Apr. 12-16, Beijing, China)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Current Paths; Data Rates; Electrical Performance; Frequency Domains; High-Speed Digital Systems; Microstrips; Model Development; Partitioning Methods; Physics-Based; S-Parameters; Signal Transition; Wave Modeling; Wave Modelling; Computer Crime; Data Flow Analysis; Electromagnetic Compatibility; Electromagnetism; Electronic Circuit Tracking; Scattering Parameters; Time Domain Analysis; Wave Propagation; Three Dimensional
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International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Apr 2010