PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors
The power distribution network (PDN) of a high-speed printed circuit board requires a high-performance power supply. The total equivalent inductance above the top ground plane is an important part of PDN design and is regarded as Labove. In this paper, an inductance library for different structures of capacitor connections and capacitor sizes has been built, which is essential for PDN design. Computer simulation technology (CST) and partial element equivalent circuit method are applied to obtain the shorted pattern design curves at various design data. The shorted pattern design curve means the total equivalent inductance varies with the distance between pad and ground plane. In addition, an approximate shorted model is established for a decoupling capacitor-mounted model, which will be convenient for us to get the inductance of Labove. In this paper, the design curve provides an intuitive guideline in designing PDN and facilitates the industry to choose what they want with consideration of the inductance, space, via numbers, etc.
S. Yang et al., "PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors," IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 6, pp. 1898 - 1906, Institute of Electrical and Electronics Engineers (IEEE), Dec 2018.
The definitive version is available at https://doi.org/10.1109/TEMC.2017.2768226
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Capacitors; Electric Impedance; Electric Network Analysis; Equivalent Circuits; Geometry; Inductance; Integrated Circuit Modeling; Layout; Partial Element Equivalent Circuit; Power Distribution Network; Power Integrity; Printed Circuit Boards; Impedance; Inductance; Partial Element Equivalent Circuit (PEEC); Power Integrity; Printed Circuit Board Power Distribution Network (PCB PDN)
International Standard Serial Number (ISSN)
Article - Journal
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Dec 2018