PCB Conductor Surface Roughness as a Layer with Effective Material Parameters
Abstract
A model to substitute conductor surface roughness in printed circuit boards by a layer with an effective material (lossy dielectric) is proposed and tested using the 2D finite-element method (FEM) electromagnetics numerical simulations. The results of numerical modeling of a multilayered structure corresponding to a stripline transmission line with substituted roughness are compared with the experimental results obtained on a TRL-calibrated test vehicle with significant roughness on conductors made of a standard (STD)-roughness copper foil.
Recommended Citation
M. Koledintseva et al., "PCB Conductor Surface Roughness as a Layer with Effective Material Parameters," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2012, Pittsburgh, PA), pp. 138 - 143, Institute of Electrical and Electronics Engineers (IEEE), Aug 2012.
The definitive version is available at https://doi.org/10.1109/ISEMC.2012.6351795
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2012: Aug. 5-10, Pittsburgh, PA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
2-D Finite-Element Methods; Copper Foils; Electromagnetics; Lossy Dielectrics; Material Parameter; Multi-Layered Structure; Stripline Transmission Lines; Test Vehicle; Electromagnetic Compatibility; Polychlorinated Biphenyls; Surface Roughness; Finite Element Method; Conductors; Dielectric Losses; Vehicles; Rough Surfaces; Laminates; Finite Element Analysis; Printed Circuits; Strip Lines; STD-Roughness Copper Foil; PCB Conductor Surface Roughness; Material Parameters; Printed Circuit Boards; 2D Finite-Element Method Electromagnetic Numerical Simulations; 2D FEM Electromagnetic Numerical Simulations; Multilayered Structure Modeling; Stripline Transmission Line; TRL-Calibrated Test Vehicle; Conductors; Standard-Roughness Copper Foil
International Standard Book Number (ISBN)
978-1467320610; 978-1467320603
International Standard Serial Number (ISSN)
2158-1118; 2158-110X
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2012
