Investigation of Mixed-Mode Input Impedance of Multi-Layer Differential Vias for Impedance Matching with Traces
In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential vias have also been studied in this paper. This method can be used to optimize via structures in PCB design processes for smooth via-trace transitions.
H. Wang et al., "Investigation of Mixed-Mode Input Impedance of Multi-Layer Differential Vias for Impedance Matching with Traces," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2009, Austin, TX), pp. 203-207, Institute of Electrical and Electronics Engineers (IEEE), Aug 2009.
The definitive version is available at https://doi.org/10.1109/ISEMC.2009.5284629
IEEE International Symposium on Electromagnetic Compatibility (2009: Aug. 17-21, Austin, TX)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Differential Via; Impedance Matchings; Input Impedance; Mixed Mode; Signal Integrity; Electric Impedance Measurement; Electromagnetic Compatibility; Impedance Matching (Electric); Multilayers; Plastic Molds; Printed Circuit Manufacture; Printed Circuit Boards; Impedance Matching; Mixed-Mode Input Impedance; Via-Trace Transition
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International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
21 Aug 2009