Frequency-Dependent Via Inductances for Accurate Power Distribution Network Modeling


In power distribution network (PDN) modeling, interconnection inductance can play a critical role. It often determines the effectiveness of a component, such as a decoupling capacitor. This paper studies a typical one-plane-pair PDN structure with parallel power and ground planes and vertical vias in between. This work improves the conventional lumped circuit model for the PDN by introducing a model for the inductance of each via that is frequency-dependent. This frequency dependency is obtained from a rigorous cavity model formulation. The improved lumped circuit model is validated with the cavity model and the HFSS full-wave model. Further, the frequency-dependent mutual inductance between two vias can have either a positive or a negative value depending on via locations in the PDN structure, which is an interesting property that has not been reported.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2009: Aug. 17-21, Austin, TX)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Model; Decoupling Capacitor; Frequency Dependencies; Frequency-Dependent; Full-Wave Model; Ground Planes; In-Between; Lumped Circuit Models; Mutual Inductance; Negative Values; Parallel Power; Power Distribution Network; Distributed Parameter Networks; Electromagnetic Compatibility; Inductance; Lumped Parameter Networks; Plastic Molds; Electric Network Analysis

International Standard Book Number (ISBN)

978-1424442676; 978-1424442669

International Standard Serial Number (ISSN)

2158-110X; 2158-1118

Document Type

Article - Conference proceedings

Document Version


File Type





© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2009