Differential and Extrapolation Techniques for Extracting Dielectric Loss of Printed Circuit Board Laminates

Abstract

The experiment-based differential and extrapolation techniques to extract frequency-dependent dielectric loss of printed circuit board laminates are proposed. Separation of dielectric loss from conductor loss on substantially rough copper foils is based on the analysis of frequency (ω) components in dielectric and conductor losses. Smooth conductor loss behaves as √ω while dielectric loss behaves as ω and ω2. However, conductor roughness behaves as √ω, ω, and ω2, and these contributions may be lumped into the dielectric loss. A few examples of extracting the unique dielectric loss parameters for PCB test striplines with the same dielectric, but with either different types of foils, or with different widths of the signal traces, are presented.

Meeting Name

IEEE MTT-S International Microwave Symposium (2011: Jun. 5-10, Baltimore, MD)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Conductor Loss; Copper Foils; Dielectric Substrates; Extrapolation Techniques; Frequency-Dependent; Loss Measurement; Signal Traces; Dielectric Devices; Extrapolation; Laminates; Molecular Physics; Printed Circuit Boards; Surface Roughness; Dielectric Losses; Conductors; Dielectric Constant; Printed Circuits

International Standard Book Number (ISBN)

978-1612847542; 978-1612847573

International Standard Serial Number (ISSN)

0149-645X

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2011

Link to Full Text

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