Differential and Extrapolation Techniques for Extracting Dielectric Loss of Printed Circuit Board Laminates
The experiment-based differential and extrapolation techniques to extract frequency-dependent dielectric loss of printed circuit board laminates are proposed. Separation of dielectric loss from conductor loss on substantially rough copper foils is based on the analysis of frequency (ω) components in dielectric and conductor losses. Smooth conductor loss behaves as √ω while dielectric loss behaves as ω and ω2. However, conductor roughness behaves as √ω, ω, and ω2, and these contributions may be lumped into the dielectric loss. A few examples of extracting the unique dielectric loss parameters for PCB test striplines with the same dielectric, but with either different types of foils, or with different widths of the signal traces, are presented.
M. Koledintseva et al., "Differential and Extrapolation Techniques for Extracting Dielectric Loss of Printed Circuit Board Laminates," Proceedings of the IEEE MTT-S International Microwave Symposium (2011, Baltimore, MD), Institute of Electrical and Electronics Engineers (IEEE), Jun 2011.
The definitive version is available at https://doi.org/10.1109/MWSYM.2011.5972948
IEEE MTT-S International Microwave Symposium (2011: Jun. 5-10, Baltimore, MD)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Conductor Loss; Copper Foils; Dielectric Substrates; Extrapolation Techniques; Frequency-Dependent; Loss Measurement; Signal Traces; Dielectric Devices; Extrapolation; Laminates; Molecular Physics; Printed Circuit Boards; Surface Roughness; Dielectric Losses; Conductors; Dielectric Constant; Printed Circuits
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© 2011 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Jun 2011