Capacitance Calculation for Offset Via Structures using an Integral Approximation Approach Based on Finite Element Method
A simple yet efficient approach is presented to extract the via-plane capacitances for an offset via structure. According to the integral approximation approach, the geometry of offset via is first divided into several segments with equally distributed angles from the origin. The two-dimensional FEM method for the concentric case is used for each segment based on its pad-stack parameters. Then, the final offset via-plane capacitance is approximated as the average of these 'segmental' capacitance values. Numerical examples demonstrated that the combined method has similar accuracy with a three-dimensional solver but it has much higher efficiency in both CPU time and memory cost.
H. Wang et al., "Capacitance Calculation for Offset Via Structures using an Integral Approximation Approach Based on Finite Element Method," Proceedings of the 43rd International Symposium on Microelectronics (2010, Raleigh, NC), pp. 408 - 412, International Microelectronics Assembly and Packaging Society, Nov 2010.
The definitive version is available at https://doi.org/10.4071/isom-2010-WA2-Paper3
43rd International Symposium on Microelectronics (2010: Oct. 31-Nov. 4, Raleigh, NC)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Capacitance Calculation; Capacitance Values; Combined Method; Higher Efficiency; Integral Approximation; Numerical Example; Segment-Based; Three-Dimensional Solvers; Finite Element Method; Microelectronics; Capacitance; Integral Approximation Approach; Offset Via Structure; Via-Plane Capacitance
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Article - Conference proceedings
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01 Nov 2010