Analysis of Noise Coupling Result from Overlapping Power Areas within Power Delivery Networks


Large area fills or entire planes constitute the backbone of the power delivery network in multi-layer printed circuit boards (PCBs). The overlapping of power areas at different voltages, though, may cause coupling among them. Full wave methods can be used to model these types of structures, and the coupling effect can be accurately analyzed by means of the finite element method (FEM), finite difference time domain (FDTD) and others. However, full wave methods are usually time consuming. In this paper, a cavity model approach is proposed to analyze the noise coupling among plane pairs in multi-layer configurations. The cavity model has analytical expressions for the impedance (Z) matrix associated with ports defined on regularly-shaped planar circuits and it is computationally efficient. The combination of such an approach with the segmentation method allows the extension of the analysis to irregularly shaped and multi-layer structures. A multi-layer PCB with three power planes is analyzed in this article by means of the proposed cavity model approach as well as a full wave FEM method. A comparison between the simulation results obtained with the two different methods is finally provided.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2006: Aug. 14-18, Portland, OR)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Model; Full Wave Methods; Multilayer PCB; Overlapping Power Area; Power Bus; Segmentation Method; Computer Simulation; Electric Potential; Finite Difference Time Domain Method; Finite Element Method; Mathematical Models; Printed Circuit Boards; Electric Power Systems; PDN

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2006