A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs
A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors.
B. Zhao et al., "A Novel Z-Directed Embedded Component for the Reduction of Voltage Ripple on the Power Distribution Network for PCBs," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017, Washington, D.C.), pp. 225-230, Institute of Electrical and Electronics Engineers (IEEE), Aug 2017.
The definitive version is available at https://doi.org/10.1109/ISEMC.2017.8077871
IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2017: Aug. 7-11, Washington, DC)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
National Science Foundation (U.S.)
Keywords and Phrases
Capacitors; Ceramic Capacitors; Electric Network Analysis; Electromagnetic Compatibility; Equivalent Circuits; Decoupling Capacitor; Multi-Layer Ceramic Capacitor; PDN Noise; Power Distribution Network; Power Distribution Network Design; Power Distribution Network Impedance; Voltage Ripples; Z-Directed Component (ZDC); Printed Circuit Boards; Equivalent Circuit; Switch Current; Voltage Ripple
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Article - Conference proceedings
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01 Aug 2017