A Concise Multiple Scattering Method for Via Array Analysis in a Circular Plate Pair
Parallel plate modes are excited by the magnetic frill currents in the via holes (anti-pads). These modes are expressed as cylindrical waves. Multiple scattering of these modes among vias as well as from the edge boundaries of the plate pair are rigorously considered with the addition theorem of the cylindrical waves. An admittance matrix is derived for the via ports at the top/bottom surfaces of the via holes. Good agreement has been found between numerical simulations and the algorithm presented.
Y. Zhang et al., "A Concise Multiple Scattering Method for Via Array Analysis in a Circular Plate Pair," Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium (2008, Seoul, South Korea), pp. 143-146, Institute of Electrical and Electronics Engineers (IEEE), Dec 2008.
The definitive version is available at https://doi.org/10.1109/EDAPS.2008.4736020
IEEE Electrical Design of Advanced Packaging and Systems Symposium (2008: Dec. 10-12, Seoul, South Korea)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Addition Theorems; Admittance Matrices; Array Analysis; Circular Plates; Cylindrical Waves; Multiple Scattering Methods; Numerical Simulations; Parallel Plates; Via Holes; Multiple Scattering; Packaging
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Dec 2008