Simulation of Automotive EMC Emission Test Procedures Based on Cable Bundle Measurements


Two time efficient simulation methods for the prediction of the conducted and radiated automotive EMC emission tests, respectively, are presented. To verify the correct prediction of the cable bundle model, a novel cable bundle test bench has been developed. It allows a fully automated network analysis with up to 32 ports. Several types of cable bundles are experimentally characterized under stochastic considerations. The system simulation for the conducted emission setup is partitioned into four parts connected on circuit level. The statistically analyzed voltage at the output of the line impedance stabilization network is in very good agreement to respective measurements. To simulate the radiated emission a novel method is presented, where the setup is partitioned by the use of Huygens principle. The simulated prediction of the antenna voltage is in good agreement with respective measurements. The presented approaches are very time efficient and therefore can be used effectively during product development.

Meeting Name

2012 IEEE MTT-S International Microwave Symposium (2012: Jun. 17-22, Montreal, QC, Canada)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Antenna Voltage; Cable Bundles; Circuit Levels; Conducted Emissions; Efficient Simulation; Emission Test; Huygens Principle; Line Impedance Stabilization Networks; Measurement Techniques; Radiated Emissions; Simulation; System Simulations; Test Benches; Computer Simulation; Electromagnetic Compatibility; Electromagnetic Coupling; Forecasting; Measurements; Numerical Analysis; Product Development; Testing; Cables; Numerical Simulation

International Standard Book Number (ISBN)

978-1-4673-1085-7; 978-1-4673-1088-8

International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2012 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2012