Application of Active Microwave Thermography to Delamination Detection


Health monitoring of infrastructure is very important in the transportation and infrastructure industries. Many nondestructive testing (NDT) techniques have been applied for structural health monitoring including microwave NDT, ultrasound, thermography, etc. Due to the complex materials (composites, concrete, etc.) commonly used, it may be difficult to thoroughly inspect a structure using one method alone. Thus, hybrid NDT methods have also been developed. Recently, the integration of microwave NDT and thermography, herein referred to as Active Microwave Thermography (AMT), has also been considered as a potential structural health monitoring tool. This hybrid method uses microwave energy to heat a structure of interest, and then the thermal surface profile is measured using a thermal camera. This paper investigates the potential of AMT to inspect rehabilitated cement-based structures. Preliminary simulations and measurements provided herein indicate that AMT has the potential to detect delaminations under carbon fiber patches bonded to concrete.

Meeting Name

IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement for Sustainable Development (2014: May 12-15, Montevideo, Uruguay)


Electrical and Computer Engineering

Keywords and Phrases

Carbon Fiber Reinforced Plastics; Concretes; Delamination; Microwaves; Planning; Structural Health Monitoring; Sustainable Development; Thermography (Imaging); Thermography (Temperature Measurement); Ultrasonic Applications; Carbon Fiber Reinforced Polymer; Cement-Based; Delamination Detections; Heat Diffusions; Infrastructure Industry; Microwave Energies; Microwave Non-Destructive Testing; Simulations And Measurements; Nondestructive Examination; Cement-Based Structures; Delamination; Heat Diffusion; Microwave Nondestructive Testing; Thermography

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


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© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2014