Transfer Function Method for Predicting the Emissions in a CISPR-25 Test-Setup
The CISPR-25 standard is used in the automotive industry to characterize the electromagnetic radiation of electronic components. The setup is comprised of an electronic device, a cable harness, a metallic table, and an antenna. Dimensions stretch from a couple of meters for the setup to fractions of a millimeter for printed circuit board features. Numerical prediction of radiated emissions (RE) is of great usefulness for prediction of potential electromagnetic compatibility nonconformities in the early design process, but extremely difficult to be done for this setup as a whole. In this paper, we demonstrate how RE can efficiently be computed based on a setup as commonly used to model conducted emissions only, i.e., electric control unit and harness on infinite-ground plane. Applying Huygens principle and using it to generate a fixed transfer function between a particularly chosen Huygens surface and the antenna, we arrive at a novel computing scheme for RE. The scheme is applied for the antenna model and antenna factor-based calculations and demonstrates agreement with measurements within 5 dB range.
A. V. Radchenko et al., "Transfer Function Method for Predicting the Emissions in a CISPR-25 Test-Setup," IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 4, pp. 894-902, Institute of Electrical and Electronics Engineers (IEEE), Aug 2014.
The definitive version is available at https://doi.org/10.1109/TEMC.2013.2297303
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Automotive industry; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic wave emission; Electronic equipment; Numerical analysis; Transfer functions; Conducted emissions; Electric control units; Electromagnetic emissions; Electronic component; Huygens principle; Numerical predictions; Radiated emissions; Transfer function method; Antennas
International Standard Serial Number (ISSN)
Article - Journal
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2014