Designing a 3D Printing Based Channel Emulator

Abstract

This research explored the possibility of building channel emulators by utilizing fused deposition modeling (FDM) 3D printing technology, which provides a rapid and low cost method with high flexibility to produce parts with many shapes of interest. Algorithms are developed for obtaining the printing pattern and loss profile based on S parameters of a target channel to be emulated. Parts with different dielectric constants, and loss tangents can be printed using filament with high dielectric constant or conductive fillers. Those parts will be placed on a low loss transmission line. As a result, different channel emulators can be built with the advantage of avoiding complicated electronic components, and only being limited in the frequency range by the base trace and its connectors.

Meeting Name

2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 3-8, Raleigh, NC)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Electric lines; Electromagnetic compatibility; Frequency division multiplexing; Permittivity; Printing; Scattering parameters; Transmission line theory; 3-D printing; Channel emulators; Conductive fillers; Electronic component; Fused deposition modeling; High dielectric constants; High flexibility; Low loss transmission lines; 3D printers; channel emulator; dielectric constants

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2014

Link to Full Text

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