De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces
Abstract
In this paper, the de-embedding study presented in [1] is extended from the simulation environment to the measurement environment; the three presented de-embedding methods are applied to measurements of on-chip coplanar traces for two different test ICs. Additionally, the Hybrid technique presented in [1] is reformulated so that only two measurement standards are required, as opposed to three. The results of de-embedding the measurement data are discussed, as well as challenges with making the measurements.
Recommended Citation
N. Erickson et al., "De-Embedding Techniques for Transmission Lines: An Application to Measurements of On-Chip Coplanar Traces," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2014, Raleigh, NC), pp. 660 - 666, Institute of Electrical and Electronics Engineers (IEEE), Aug 2014.
The definitive version is available at https://doi.org/10.1109/ISEMC.2014.6899052
Meeting Name
2014 IEEE International Symposium on Electromagnetic Compatibility (2014: Aug. 4-8, Raleigh, NC)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
De-embedding; De-embedding method; De-embedding techniques; Hybrid techniques; Measurement data; Measurement standards; Measurements of; Simulation environment; Electromagnetic compatibility
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2014 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
08 Aug 2014
