Bandwidth Improvement Technique for an Edge Mount SMA Launch Structure in Multilayer Boards
Abstract
A technique to improve the bandwidth of an edge mount SMA launch structure in multilayer boards is proposed. The edge mount SMA launch structure is widely used in fixtures and calibration boards for high-speed serial links, but can suffer from return-path discontinuities in multilayer boards, resulting in bandwidth limitation. The discontinuities in the edge mount SMA launch structure deteriorate the signal transmission quality at high frequencies. An edge mount SMA launch structure is investigated based on a waveguide analysis and relevant analytical equation. In addition, a simple method to mitigate the discontinuity due to the wave propagation into the waveguide structures formed by the multiple return planes in a multilayer board is proposed by using an edge plating technique and validated through numerical simulations.
Recommended Citation
C. Hwang et al., "Bandwidth Improvement Technique for an Edge Mount SMA Launch Structure in Multilayer Boards," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), pp. 308 - 311, Institute of Electrical and Electronics Engineers (IEEE), Sep 2016.
The definitive version is available at https://doi.org/10.1109/ISEMC.2016.7571664
Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016 (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Calibration; Electromagnetic compatibility; Fixtures (tooling); Multilayers; Numerical methods; Wave propagation; Waveguides; Analytical equations; Bandwidth limitation; De-embedding; High speed serial links; High-speed boards; Improvement technique; quarter-lambda frequency; Signal transmission quality; Bandwidth; SMA; SMA launch structure
International Standard Book Number (ISBN)
978-150901441-5
International Standard Serial Number (ISSN)
1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2016
Comments
This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.