Characterizing EMI Radiation Physics Corresponding to Distributive Geometry Features using the PEEC Method


The reduction of electromagnetic radiation and couplings is a fundamental issue for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues. Even though they represent distributed sources, radiation physics was seldom mapped to the geometry of the structure. In this paper, we develop a new approach based on PEEC to calculate the distributed sources for radiation and the couplings. With this approach, the radiated power from each segment as well as the transferred power between each part is evaluated. Furthermore, the physical meaning of the resultant power is interpreted. It is known that currents curved structures, bents, and other discontinuous and truncated structures cause significant radiation. The radiation from each part can be quantitatively analyzed. This method can be used to physically interpret and predict which features and structures have a small or a large impact on radiation. This provides powerful insight for diagnosing of radiation and couplings. Hence, this can be an important tool for product optimization's for EMI designs.

Meeting Name

2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)


Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Second Research Center/Lab

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Couplings; Electromagnetic pulse; Electromagnetic wave interference; Electromagnetic waves; Geometry; Heat radiation; Radiation; Signal interference; Curved structure; Distributed sources; Geometry features; New approaches; PEEC; Physical meanings; Product optimization; Radiation physics; Electromagnetic compatibility

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2016