Efficient Analysis of Power/Ground Planes Loaded with Dielectric Rods and Decoupling Capacitors by Extended Generalized Multiple Scattering Method


Generalized multiple scattering (GMS) method, previously proposed for signal integrity analysis of vias, is now extended to power integrity analysis of power/ground planes loaded with circular dielectric rods and decoupling capacitors. The transition matrices of the rods and decoupling capacitors are derived from boundary value problems and equivalent circuits, respectively. The transition matrices are then regarded as loads to the radial scattering matrix obtained by the GMS method. Therefore, a parallel-plate impedance matrix, which characterizes the power integrity performance, can be obtained. To understand physically different noise suppression mechanisms in power/ground planes with dielectric rods or photonic crystals, the field distributions in power/ground planes are derived in more detail. It is found that there are three kinds of resonances: one due to the cavity formed by the plane pair, one due to the cavity formed by surrounding dielectric rods, and one caused by the individual dielectric rod itself. The accuracy and efficiency of the extended GMS method are verified by comparing with a commercial full-wave solver.


Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Second Research Center/Lab

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Boundary value problems; Capacitors; Energy gap; Equivalent circuits; Multiple scattering; Photonic band gap; Photonic crystals; Scattering parameters; Decoupling capacitor; Electromagnetic band gaps; Field distribution; Multiple scattering method; Signal integrity analysis; Signal/power integrity; Simultaneously switching noise; Transition matrices; Phonon scattering

International Standard Serial Number (ISSN)


Document Type

Article - Journal

Document Version


File Type





© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Feb 2015