In high-speed data communication systems, the complexity of link path between transmitters and receivers present a challenge for designers to maintain an acceptable bit error rate. An approach is presented in this paper to design the link path on a block-by-block basis. The unique advantage of this approach lies on the physics-based model of each block, which relates performance to geometry and makes design improvement and optimization possible. An example link path involving a backpanel is investigated using the approach. The via stubs and the dielectric materials in the backpanel are demonstrated to be critical factors for link performance in certain situations.

Meeting Name

2008 IEEE International Symposium on Electromagnetic Compatibility, 2008


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Backpanel; Block-By-Block Approach; Link Path Design; Via Stub

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2008