In high-speed data communication systems, the complexity of link path between transmitters and receivers present a challenge for designers to maintain an acceptable bit error rate. An approach is presented in this paper to design the link path on a block-by-block basis. The unique advantage of this approach lies on the physics-based model of each block, which relates performance to geometry and makes design improvement and optimization possible. An example link path involving a backpanel is investigated using the approach. The via stubs and the dielectric materials in the backpanel are demonstrated to be critical factors for link performance in certain situations.
F. de Paulis et al., "Link Path Design on a Block-by-Block Basis," Proceedings of the 2008 IEEE International Symposium on Electromagnetic Compatibility, 2008, Institute of Electrical and Electronics Engineers (IEEE), Aug 2008.
The definitive version is available at https://doi.org/10.1109/ISEMC.2008.4652140
2008 IEEE International Symposium on Electromagnetic Compatibility, 2008
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Backpanel; Block-By-Block Approach; Link Path Design; Via Stub
Article - Conference proceedings
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2008