The investigation of decoupling issues has been extensively treated in the literature in both the frequency and the time domain [1-9]. The two domains describe from different perspectives the same physical phenomenon, being related by a Fourier transform. In this article, well known decoupling issues usually addressed in the frequency domain [1,2] are discussed in the time domain. Moreover, some modeling issues related to the cavity model approach are discussed and, in particular, the circuit extraction feature associated with this methodology is utilized throughout the article to carry out the time domain simulations within a SPICE based-tool. The depletion of charges stored between the power bus is investigated in the time domain as a function of the plane thickness, SMT decoupling closeness and interconnect inductance values.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2007: Jul. 9-13, Honolulu, HI)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Fourier Transforms; Frequency-Domain Analysis; Printed Circuits; Time-Domain Analysis; Cavity Model; Charge Depletion; Decoupling Issues; Power Delivery Network; Electric Inverters; Electric Power Transmission; Feature Extraction; Networks (Circuits); Plastic Molds; Power Electronics; SPICE; Frequency Domains; Interconnect Inductances; Physical Phenomenons; Power Buses; Time Domains; Time-Domain Simulations; Two Domains; Electromagnetic Compatibility

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)

2158-110X; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2007 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2007