Power bus structures consisting of two parallel conducting planes are widely used on high-speed printed circuit boards. In this paper, a full-wave finite-element method (FEM) method is used to analyze power bus structures, and the resulting matrix equations are converted to equivalent circuits that can be analyzed using SPICE programs. Using this method of combining FEM and SPICE, power bus structures of arbitrary shape can be modeled efficiently both in the time-domain and frequency-domain, along with the circuit components connected to the bus. Dielectric loss and losses due to the finite resistance of the power planes can also be modeled. Practical examples are presented to validate this method.
T. H. Hubing and C. Guo, "Circuit Models for Power Bus Structures on Printed Circuit Boards using a Hybrid FEM-SPICE Method," IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers (IEEE), Jan 2006.
The definitive version is available at https://doi.org/10.1109/TADVP.2006.875089
Electrical and Computer Engineering
Keywords and Phrases
Finite-Element Method (FEM); SPICE; SPICE Analysis; Circuit Component; Circuit Models; Dielectric Loss; Equivalent Circuits; Finite Element Analysis; Finite Resistance Loss; Frequency-Domain Analysis; Frequency-Domain Modeling; Full-Wave Finite-Element Method; Hybrid FEM-SPICE Method; Modeling; Power Bus Structures; Power Electronics; Printed Circuit Boards; Printed Circuits; Time-Domain Analysis; Time-Domain Modeling
International Standard Serial Number (ISSN)
Article - Journal
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.