Nowdays the fast and increased demand for bandwidth in the telecommunication world translates into the design of complex boards exchanging data at high bit rate in reduced design cycle. Sometimes it is impossible to spent time in setting pre-layout simulations, because they are not compatible with the design time schedule. In this scenario it is better to design the boards using experience and then make simulations in conjunction with measurements, using customized numerical tools which don't need complex models.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility: EMC Europe (2008: Sep. 8-12, Hamburg, Germany)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Dielectric Losses; Differential Serial Link; Frequency Domain Measurements; Printed Circuit Board; Time Domain Measurements; Backplanes; Complex Models; Design Cycles; Design Time; Differential Serial Link; Frequency Domain Measurements; High Bit Rates; Numerical Tools; Bandwidth; Ceramic Capacitors; Design; Dielectric Devices; Dielectric Losses; Electric Inverters; Electromagnetic Compatibility; Electromagnetic Wave Emission; Frequency Domain Analysis; Plastic Molds; Printed Circuit Manufacture; Telecommunication Systems; Printed Circuit Boards

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)

2325-0356; 2325-0364

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Sep 2008