The analysis and the design of the Power Delivery Network (PDN) is crucial in the real world of high-speed and high-performance on-board systems. In this context, the Cavity Model (where facing portions of power bus are considered electromagnetic resonant cavities) can be used to study the generation and propagation of noise. Given a real-world board's layout, one of the primary requirements for the application of this technique is the geometrical identification of all the cavities and their connectivity. This paper is focused on the fully automatic generation of this geometrical dataset as part of an integrated tool for the analysis and design of PDN.
S. Cicerone et al., "Cavities' Identification Algorithm for Power Integrity Analysis of Complex Boards," Proceedings of the 20th International Zurich Symposium on Electromagnetic Compatibility (2009, Zurich, Switzerland), pp. 253-256, Institute of Electrical and Electronics Engineers (IEEE), Jan 2009.
The definitive version is available at https://doi.org/10.1109/EMCZUR.2009.4783438
20th International Zurich Symposium on Electromagnetic Compatibility (2009: Jan. 12-16, Zurich, Switzerland)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Application Specific Integrated Circuits; Electromagnetic Compatibility; Power Integrated Circuits; Algorithm Design And Analysis; Noise Generators; Integrated Circuit Noise; Power Generation; Electromagnetic Interference; Active Noise Reduction; Electromagnetic Modeling; Electromagnetic Propagation; Switching Circuits; Clocks; Analysis And Designs; Automatic Generations; Cavity Models; Data Sets; High-Speed; Identification Algorithms; Integrated Tools; On-Board Systems; Power Bus; Power Delivery Networks; Power Integrities; Real-World; Resonant Cavities; Electric Inverters; Electric Network Analysis; Electric Power Transmission; Electromagnetism; Plastic Molds; Power Electronics
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Jan 2009