The increasing speed of digital circuit design as well as the density of printed circuit board (PCB) layouts often result in more challenging electromagnetic interference (EMI) problems. The coupling between a high-speed digital line and an I/O line can be a primary EMI coupling path, and the attached cable a dominant radiator. This mechanism is studied and modeled herein in a multi-stage modeling fashion. EMI modeling is developed for coupling between the transmission lines, and the attached cable as the EMI antenna. Finally, the EMI is calculated for the coupled noise driving the attached cable. The agreement between the modeled and measured results demonstrates that the modeling method is suitable for estimating the EMI due to high-frequency coupling to I/O lines.
W. Cui et al., "Anticipating EMI from Coupling Between High-Speed Digital and I/O Lines," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1999, Seattle, WA), vol. 1, pp. 189-194, Institute of Electrical and Electronics Engineers (IEEE), Aug 1999.
The definitive version is available at https://doi.org/10.1109/ISEMC.1999.812893
IEEE International Symposium on Electromagnetic Compatibility (1999: Aug. 2-6, Seattle, WA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
EMI Antenna; EMI Coupling Path; EMI Estimation; EMI Modeling; I/O Lines; PCB Layout Density; Cable; Coupled Noise; Coupled Transmission Lines; Digital Circuit Design; Digital Circuits; Electric Current Measurement; Electric Impedance Measurement; Electric Noise Measurement; Electromagnetic Coupling; Electromagnetic Interference; High-Frequency Coupling; High-Speed Digital Lines; Measured Results; Microstrip; Microstrip Lines; Multi-Stage Modeling; Noise; Printed Circuit Board Layout; Printed Circuit Layout; Radiator; Strip Lines; Stripline; Transmission Line Theory; Transmission Lines Coupling
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 1999 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 1999