It is well known that a properly placed conductive gasket can complete an enclosure to yield good shielding. But often there are reasons, e.g. control of mechanical dimensions that this cannot be achieved. For these cases, one may want to avoid using a gasket that requires contacts. This paper will analyze alternatives to continuously contacting gaskets such as overlap structures, overlapping structures with different lossy and non-lossy materials, and overlaps with grounding points. It will compare structures by sufficient shielding for a typical class B product, high frequency (1-3 GHz) and low frequency (below 1 GHz) performance.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2002: Aug. 19-23, Minneapolis, MN)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

1 to 3 GHz; Class B Product; Conductive Gasket Alternative; Continuously Contacting Gaskets; Earthing; Electromagnetic Compatibility; Electromagnetic Shielding; Enclosure Shielding; Grounding Points; Lossy Materials; Mechanical Dimensions; Nonlossy Materials; Overlap Structures; Packaging; Shielding Performance; Gaskets; Overlap; Shielding Effectiveness

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2002