An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility, 2004


Electrical and Computer Engineering

Keywords and Phrases

EMC; EMI; PCB Designs; Q-Factor; Conductor Loss; Dielectric Loss; Dielectric Losses; Electric Impedance; Electromagnetic Compatibility; Electromagnetic Coupling; Electromagnetic Interference; Input Impedance; Network Analysis; Power-Return Plane Structures; Printed Circuit Layout; Printed Circuits; Propagating Wavenumber; Quality Factors; Radiation Loss; Reflection Coefficient; Via Coupling

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jan 2004