Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner.
T. H. Hubing, "The Role of Component Packaging in System Electromagnetic Compatibility," Proceedings of the IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, 1994, Institute of Electrical and Electronics Engineers (IEEE), Jan 1994.
The definitive version is available at https://doi.org/10.1109/EPEP.1994.594068
IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, 1994
Electrical and Computer Engineering
Keywords and Phrases
EMC Design Models; Component Packaging; Electromagnetic Compatibility; Electronic Systems; Packaging
Article - Conference proceedings
© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Jan 1994