A non-orthogonal time-domain full-wave solver, is developed based on the Discrete Surface Integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalized finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (1995: Aug. 14-18, Atlanta, GA)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

S-Parameters; Closed Form Expressions; Coefficients; Discrete Surface Integral; Discrete Surface Integral Method; Finite Difference Time-Domain Analysis; Finite-Difference Procedure; Integral Equations; Interconnect Vias; Measured Results; Nonorthogonal Time-Domain Full-Wave Solver; Printed Circuits; Propagation Characteristics; Scattering Parameters; Square Via

International Standard Book Number (ISBN)

0780325737; 0780336089

International Standard Serial Number (ISSN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 1995 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 1995