This paper experimentally investigates the effectiveness of embedded capacitance for reducing power-bus noise in high-speed printed circuit board designs. Boards with embedded capacitance employ closely spaced power-return plane pairs separated by a thin layer of dielectric material. In this paper, test boards with four embedded capacitance materials are evaluated. Power-bus input impedance measurements and power-bus noise measurements are presented for boards with various dimensions and layer stack ups. Unlike discrete decoupling capacitors, whose effective frequency range is generally limited to a few hundred megahertz due to interconnect inductance, embedded capacitance was found to efficiently reduce power-bus noise over the entire frequency range evaluated (up to 5 GHz).
M. Xu et al., "Power-Bus Decoupling with Embedded Capacitance in Printed Circuit Board Design," IEEE Transactions on Electromagnetic Compatibility, vol. 45, no. 1, pp. 22 - 30, Institute of Electrical and Electronics Engineers (IEEE), Feb 2003.
The definitive version is available at https://doi.org/10.1109/TEMC.2002.808075
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
5 GHz; Capacitance; Circuit Noise; Closely Spaced Power-Return Plane Pairs; Digital Circuits; Electromagnetic Compatibility; Embedded Capacitance; High-Speed PCB Designs; High-Speed Digital Designs; Interference Suppression; Layer Stack Ups; Power-Bus Decoupling; Power-Bus Input Impedance Measurements; Power-Bus Noise Measurements; Power-Bus Noise Reduction; Printed Circuit Board Designs; Printed Circuit Design; Printed Circuit Testing; Thin Dielectric Material Layer; Conduction Loss; Decoupling Capacitor; Embedded Capacitance (Buried Capacitance); Power Plane; Power-Bus Impedance; Power-Bus Noise (Delta-I Noise, Ground Bounce Noise, Simultaneous Switch Noise); Return Plane
International Standard Serial Number (ISSN)
Article - Journal
© 2003 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Feb 2003