Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair of differential vias have been modeled. The simulated results clearly demonstrate the impact of ground vias and via stubs on noise coupling.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility (2008: Aug. 18-22, Detroit, MI)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Cavity Model; Differential Signal; Ground Vias; Noise Coupling Between Signal and Power/Ground Nets; Signal Via Transition; Via Capacitance; Analysis; Noise; Integrated Circuit Modeling; Couplings; Geometry; Microstrip; Impedance; Stripline; Transmission Lines; Electromagnetic Coupling; Network Routing; Printed Circuits; Printed Circuit Board; Noise Coupling; Ground Nets; Power Nets; Differential Vias Transition; Multilayer PCB; Routing Trace; Transmission Line Model; Physics-Based Via-Plane Model

International Standard Book Number (ISBN)


International Standard Serial Number (ISSN)

2158-110X; 2158-1118

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2008