Recommended Citation
T. H. Hubing and T. Van Doren, "New EMC Design Guidelines for Multilayer Printed Wiring Boards," Proceedings of the Electrical Performance of Electronic Packaging, 1992, Institute of Electrical and Electronics Engineers (IEEE), Jan 1992.
The definitive version is available at https://doi.org/10.1109/EPEP.1992.572280
Meeting Name
Electrical Performance of Electronic Packaging, 1992
Department(s)
Electrical and Computer Engineering
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1992 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 1992
