When the performances of the electronic technology increase (higher frequencies, more power, lover power supply, faster transistors, reduced chip dimensions), designing electronic equipment becomes more challenging for the electronic engineers. Signal and power integrity on board become of paramount importance. One of the main causes of board malfunctions and electromagnetic radiation is the simultaneous switching noise (SSN) due to the integrated circuits soldered on the board. The paper proposes two simple procedures to model the SSN, so to evaluate its effects in any point of the board.

Meeting Name

10th IEEE Workshop on Signal Propagation on Interconnects (2006: May 9-12, Berlin, Germany)


Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Electric Currents; Mathematical Models; Switching Functions; Transistors; High Speed Digital Boards; Switching Currents; Integrated Circuits; Integrated Circuit Modeling; High Speed Integrated Circuits; Digital Integrated Circuits; Integrated Circuit Noise; Frequency; Power Supplies; Electronic Equipment; Design Engineering; Power Engineering And Energy; Electromagnetic Radiation; Field Programmable Gate Arrays; FPGA; IC; Switching Currents; Power Bus; High Speed Digital Board; Simultaneous Switching Noise; Electromagnetic Radiation; Board Malfunctions

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version

Final Version

File Type





© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 May 2006