Noise on the DC power-bus attributed to device switching is among the primary sources of EMI and signal integrity problems. A mixed-potential integral equation formulation with circuit extraction approach is used to model the planar multi-layer power-bus geometry, which can also include arbitrary shaped power regions on multiple layers. Incorporating vertical discontinuities, e.g., decoupling capacitor interconnects, is a critical aspect of the modeling, and must be done properly since they are included as a lumped element model and not a part of the MPIE formulation. Agreement with experimental results demonstrate the present approach.
J. Fan et al., "Incorporating Vertical Discontinuities in Power-Bus Modeling using a Mixed-Potential Integral Equation and Circuit Extraction Formulation," Proceedings of the IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (1998, West Point, NY), pp. 171 - 174, Institute of Electrical and Electronics Engineers (IEEE), Oct 1998.
The definitive version is available at https://doi.org/10.1109/EPEP.1998.733956
IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (1998: Oct. 26-28, West Point, NY)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
DC Power-Bus Noise; EMI; MPIE Formulation; Arbitrary Shaped Power Regions; Capacitors; Circuit Analysis Computing; Circuit Extraction; Circuit Extraction Formulation; Circuit Noise; Decoupling Capacitor Interconnects; Device Switching; Driver Circuits; Electric Field Integral Equations; Electromagnetic Interference; Lumped Element Model; Mixed-Potential Integral Equation; Modeling; Multilayer PCBs; Multiple Layers; Packaging; Planar Multi-Layer Power-Bus Geometry; Power-Bus Modeling; Printed Circuit Design; Signal Integrity; Vertical Discontinuities
International Standard Book Number (ISBN)
Article - Conference proceedings
© 1998 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 1998