Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, the EMI mitigation approach of adding decoupling capacitors was investigated with the FDTD method.
W. Cui et al., "EMI Resulting from a Signal Via Transition Through DC Power Bus-Effectiveness of Focal SMT Decoupling," Proceedings of the 2nd Asia-Pacific Conference on Environmental Electromagnetics (2000, Shanghai, China), pp. 91 - 95, Institute of Electrical and Electronics Engineers (IEEE), May 2000.
The definitive version is available at https://doi.org/10.1109/CEEM.2000.853908
2nd Asia-Pacific Conference on Environmental Electromagnetics (2000: May 3-7, Shanghai, China)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
DC Power Bus; EMI; Electromagnetic Interference; Equivalent Circuits; Finite Difference Time-Domain Analysis; Finite-Difference Time-Domain Method; Focal SMT Decoupling; Method of Moments; Moment Method; Multilayer Printed Circuit Board Design; Partial Element Equivalent Circuit; Printed Circuits; Reference Plane; Surface Mount Technology; Electric Network Analysis; Equivalent Circuits; Finite Difference Time Domain Method; Numerical Methods; Printed Circuit Boards; Printed Circuit Design; Printed Circuits; Reconfigurable Hardware; Decoupling Capacitor; EMI Mitigation; Finite-Difference Time Domains (FDTD); Multilayer Printed Circuit Board; Power And Ground Planes; Power Bus Noise; Reference Plane; Time Domain Analysis
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 May 2000