When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.
S. Wu et al., "Eliminating Via-Plane Coupling using Ground Vias for High-Speed Signal Transitions," Proceedings of the Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP, Institute of Electrical and Electronics Engineers (IEEE), Oct 2008.
The definitive version is available at https://doi.org/10.1109/EPEP.2008.4675926
Electrical Performance of Electronic Packaging, 2008. IEEE-EPEP
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Equivalent Circuits; Integrated Circuit Modeling; Printed Circuit Design
Article - Conference proceedings
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 2008