"In high-speed digital design, signal via transitions on printed circuit boards (PCBs) are becoming an important signal integrity issue. Efficient and accurate models for via transitions are necessary to analyze high bit-rate digital circuit system. The circuit extraction approach based on a mixed-potential integral equation formulation (CEMPIE) is an extension of the Partial Element Equivalent Circuit approach (PEEC) to general multi-layered media. CEMPIE was further developed to include the horizontal current components on the vertical surface and extended to model the discontinuities on multilayer PCBs. A procedure of building SPICE models for signal via transitions between printed circuit board layers was developed. The method of extracting SPICE model parameters from full-wave simulation tool was studied. The validity of SPICE models was studied by comparing solutions from SPICE models with solutions from full-wave simulations. This procedure was further used for building SPICE models for via transitions in differential signaling"--Abstract, page iii.
Drewniak, James L.
Fan, Jun, 1971-
DuBroff, Richard E.
Hubing, Todd H.
Hale, Barbara N.
Electrical and Computer Engineering
Ph. D. in Electrical Engineering
University of Missouri--Rolla
Journal article titles appearing in thesis/dissertation
- Modeling vertical discontinuities on multi-layer PCBs using a circuit extraction approach based on a mixed-potential integral equation formulation
x, 107 pages
© 2005 Shaofeng Luan, All rights reserved.
Dissertation - Open Access
Printed circuits -- Design and construction
Electronic circuit design
Print OCLC #
Electronic OCLC #
Link to Catalog Record
Luan, Shaofeng, "CAD model extraction of PCB signal discontinuity using a circuit extraction approach based on mixed-potential integral equation formulation" (2005). Doctoral Dissertations. 1603.