Doctoral Dissertations

Author

Shaofeng Luan

Abstract

"In high-speed digital design, signal via transitions on printed circuit boards (PCBs) are becoming an important signal integrity issue. Efficient and accurate models for via transitions are necessary to analyze high bit-rate digital circuit system. The circuit extraction approach based on a mixed-potential integral equation formulation (CEMPIE) is an extension of the Partial Element Equivalent Circuit approach (PEEC) to general multi-layered media. CEMPIE was further developed to include the horizontal current components on the vertical surface and extended to model the discontinuities on multilayer PCBs. A procedure of building SPICE models for signal via transitions between printed circuit board layers was developed. The method of extracting SPICE model parameters from full-wave simulation tool was studied. The validity of SPICE models was studied by comparing solutions from SPICE models with solutions from full-wave simulations. This procedure was further used for building SPICE models for via transitions in differential signaling"--Abstract, page iii.

Advisor(s)

Drewniak, James L.

Committee Member(s)

Fan, Jun, 1971-
DuBroff, Richard E.
Pommerenke, David
Hubing, Todd H.
Hale, Barbara N.

Department(s)

Electrical and Computer Engineering

Degree Name

Ph. D. in Electrical Engineering

Publisher

University of Missouri--Rolla

Publication Date

Spring 2005

Journal article titles appearing in thesis/dissertation

  • Modeling vertical discontinuities on multi-layer PCBs using a circuit extraction approach based on a mixed-potential integral equation formulation

Pagination

x, 107 pages

Note about bibliography

Includes bibliographical references (pages 104-106).

Rights

© 2005 Shaofeng Luan, All rights reserved.

Document Type

Dissertation - Open Access

File Type

text

Language

English

Subject Headings

Printed circuits -- Design and construction
Electromagnetic compatibility
Electronic circuit design

Thesis Number

T 8732

Print OCLC #

64023142

Electronic OCLC #

1105575922

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