The current object-oriented class-based approaches to hardware/software co-analysis/co-design of embedded systems are limited in their abilities to properly capture the structure of individual instances of hardware and software components and their interactions. This paper discusses a methodology to extend a structured objectoriented hardware/software co-design methodology based on the High Order Object-oriented Modeling Technique (HOOMT) to incorporate instance-based object and behavioral models. The instance-based structured object-oriented methodology will enable description of a system's structure based on individual instances of hardware and software components and specification of the interactions among them. In addition, lattices are introduced to specify the concurrent behavior of hardware/software components in a concurrent embedded system. These additions further enhance the method's capability of providing a precise set of specifications that can be understood easily by both hardware and software designers in co-analysis/codesign. The methodology has been applied to the specification of hardware and software of a simulated advanced power grid control system.
M. Ryan et al., "An Instance-Based Structured Object Oriented Method for Co-Analysis/Co-Design of Concurrent Embedded Systems," Proceedings of the 30th Annual International Computer Software and Applications Conference (COMPSAC'06) (2006, Chicago, IL), Institute of Electrical and Electronics Engineers (IEEE), Sep 2006.
The definitive version is available at https://doi.org/10.1109/COMPSAC.2006.26
30th Annual International Computer Software and Applications Conference (COMPSAC'06) (2006: Sep. 17-21, Chicago, IL)
Electrical and Computer Engineering
Intelligent Systems Center
National Science Foundation (U.S.)
Keywords and Phrases
Concurrent Process; Hardware/Software Co-Analysis; Hardware/Software Co-Design; Instance-Based Co-Analysis/Co-Design; Integration; Structured Object-Oriented Method; Embedded computer systems; Multitasking (Computer science)
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Article - Conference proceedings
© 2006 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Sep 2006