Debonding Test Method to Evaluate Bond Strength between UHPC and Concrete Substrate

Abstract

The use of the pull-off test to evaluate the interfacial bond strength between substrate concrete and bonded materials can result in failure of the concrete substrate without clear indication of the interfacial bond strength. Proper knowledge of the interfacial bond strength between a repair material and concrete substrate is critical for the selection of repair materials and for the modeling of the performance of the composite section. This includes ultra-high performance concrete (UHPC) used for thin bonded overlays of concrete bridge decks. The bond strength of UHPC to concrete substrate sections was evaluated in this study using the pull-off test, a modified version of the pull-off test, and the modified splitting tensile strength test. The results identified some challenges with respect to the characterization of interfacial bond and associated variability of test results. A new test method proposed to determine the interfacial bond strength showed that bond strength can range between 2.3 and 3.5 MPa and low coefficient of variation of 1.4% and 3.4%, respectively.

Department(s)

Civil, Architectural and Environmental Engineering

Research Center/Lab(s)

Re-Cast Tier1 University Transportation Center

Second Research Center/Lab

Center for Research in Energy and Environment (CREE)

Comments

The authors acknowledge the financial support provided by Missouri Department of Transportation (Grant Number: TR2015-03) and the RE-CAST (Research on Concrete Applications for Sustainable Transportation) Tier-1 University Transportation Center (UTC) at Missouri University of Science and Technology (Grant Number: 00046726).

Keywords and Phrases

Bonded overlay; Interface Bond Strength; Pull-Off Test Method; Repair Materials; Tensile Strength; UHPC

International Standard Serial Number (ISSN)

1359-5997; 1871-6873

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2020 Springer, All rights reserved.

Publication Date

01 Feb 2020

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