Debonding Test Method to Evaluate Bond Strength between UHPC and Concrete Substrate
The use of the pull-off test to evaluate the interfacial bond strength between substrate concrete and bonded materials can result in failure of the concrete substrate without clear indication of the interfacial bond strength. Proper knowledge of the interfacial bond strength between a repair material and concrete substrate is critical for the selection of repair materials and for the modeling of the performance of the composite section. This includes ultra-high performance concrete (UHPC) used for thin bonded overlays of concrete bridge decks. The bond strength of UHPC to concrete substrate sections was evaluated in this study using the pull-off test, a modified version of the pull-off test, and the modified splitting tensile strength test. The results identified some challenges with respect to the characterization of interfacial bond and associated variability of test results. A new test method proposed to determine the interfacial bond strength showed that bond strength can range between 2.3 and 3.5 MPa and low coefficient of variation of 1.4% and 3.4%, respectively.
M. Valipour and K. Khayat, "Debonding Test Method to Evaluate Bond Strength between UHPC and Concrete Substrate," Materials and Structures/Materiaux et Constructions, vol. 53, no. 1, Springer, Feb 2020.
The definitive version is available at https://doi.org/10.1617/s11527-020-1446-6
Civil, Architectural and Environmental Engineering
Re-Cast Tier1 University Transportation Center
Second Research Center/Lab
Center for Research in Energy and Environment (CREE)
Keywords and Phrases
Bonded overlay; Interface Bond Strength; Pull-Off Test Method; Repair Materials; Tensile Strength; UHPC
International Standard Serial Number (ISSN)
Article - Journal
© 2020 Springer, All rights reserved.
01 Feb 2020