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| Title: | The influence of test parameters on TEM cell measurements of ICs | |
| Author (s): | Kasturi, Vijay Beetner, Daryl G. | |
| Department/Lab Affiliations: | Electrical and Computer Engineering Electromagnetic Compatibility Laboratory | |
| Keywords: | TEM-cell method emissions | |
| Subject Terms: | Electromagnetic compatibility. Integrated circuits. Testing. | |
| Issue Date: | 2008-08 | |
| Publisher: | Institute of Electrical and Electronics Engineers IEEE | |
| Citation: | Kasturi, Vijay and Beetner, Daryl, "The influence of test parameters on TEM cell measurements of ICs." IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (Aug. 2008): 1 - 6. | |
| Abstract: | The IEC 61967-2 TEM cell standard allows for variations in test parameters which may cause variations in the measured emissions from integrated circuits (ICs). To test the impact of these parameters, two printed circuit boards were designed within the IEC standard using “poor” PCB design strategies and using “good” design strategies. Emissions from three pin-for-pin compatible 8051 microcontrollers were tested. Emissions were measured using both PCBs, changing the PCB configuration, and changing test parameters like the program running on the IC, the rise time of the input clock, and I/O switching. Emissions from the “poor” PCB were about 3–8 dB higher than emissions from the “good” PCB. A change in the program run by the IC, the clock rise-time, and I/O caused a 4–15 dB change in emissions. Emissions differed considerably among the ICs. Possible causes for variations in emissions with the test parameters are discussed. | |
| Type: | Article - Conference proceedings text | |
| In Title: | IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008. | |
| Copyright Notice: | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. can upload final version FULL COPYRIGHT INFORMATION: | |
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| title | The influence of test parameters on TEM cell measurements of ICs | |
| contributor.author | Kasturi, Vijay | |
| contributor.author | Beetner, Daryl G. | |
| contributor.deptlab | Electrical and Computer Engineering | |
| contributor.deptlab | Electromagnetic Compatibility Laboratory | |
| subject | TEM-cell method | |
| subject | emissions | |
| subject.LCSH | Electromagnetic compatibility. | |
| subject.LCSH | Integrated circuits. | |
| subject.LCSH | Testing. | |
| date.issued | 2008-08 | |
| publisher | Institute of Electrical and Electronics Engineers IEEE | |
| identifier.citation | Kasturi, Vijay and Beetner, Daryl, "The influence of test parameters on TEM cell measurements of ICs." IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (Aug. 2008): 1 - 6. | |
| identifier.pub.URI | ||
| description.abstract | The IEC 61967-2 TEM cell standard allows for variations in test parameters which may cause variations in the measured emissions from integrated circuits (ICs). To test the impact of these parameters, two printed circuit boards were designed within the IEC standard using “poor” PCB design strategies and using “good” design strategies. Emissions from three pin-for-pin compatible 8051 microcontrollers were tested. Emissions were measured using both PCBs, changing the PCB configuration, and changing test parameters like the program running on the IC, the rise time of the input clock, and I/O switching. Emissions from the “poor” PCB were about 3–8 dB higher than emissions from the “good” PCB. A change in the program run by the IC, the clock rise-time, and I/O caused a 4–15 dB change in emissions. Emissions differed considerably among the ICs. Possible causes for variations in emissions with the test parameters are discussed. | |
| type | Article - Conference proceedings | |
| type.DCMIType | text | |
| type.status | Final version | |
| relation.isPartOf | IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008. | |
| rights | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | |
| rights | can upload final version | |
| rights.URI | ||
| rights.URI | ||
| rights.URI | ||
| date.accessioned | 2008-12-02T19:00:03Z | |
| identifier.persist.URI | ||
| date.available | 2008-12-02T22:08:21Z | |
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