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Title: The influence of test parameters on TEM cell measurements of ICs
Author (s): Kasturi, Vijay
Beetner, Daryl G.
Department/Lab Affiliations: Electrical and Computer Engineering
Electromagnetic Compatibility Laboratory
Keywords: TEM-cell method
emissions
Subject Terms: Electromagnetic compatibility.
Integrated circuits.
Testing.
Issue Date: 2008-08
Publisher: Institute of Electrical and Electronics Engineers IEEE
Citation: Kasturi, Vijay and Beetner, Daryl, "The influence of test parameters on TEM cell measurements of ICs." IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (Aug. 2008): 1 - 6.
Abstract: The IEC 61967-2 TEM cell standard allows for variations in test parameters which may cause variations in the measured emissions from integrated circuits (ICs). To test the impact of these parameters, two printed circuit boards were designed within the IEC standard using “poor” PCB design strategies and using “good” design strategies. Emissions from three pin-for-pin compatible 8051 microcontrollers were tested. Emissions were measured using both PCBs, changing the PCB configuration, and changing test parameters like the program running on the IC, the rise time of the input clock, and I/O switching. Emissions from the “poor” PCB were about 3–8 dB higher than emissions from the “good” PCB. A change in the program run by the IC, the clock rise-time, and I/O caused a 4–15 dB change in emissions. Emissions differed considerably among the ICs. Possible causes for variations in emissions with the test parameters are discussed.
Type: Article - Conference proceedings
text
In Title: IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008.
Copyright Notice: This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
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FULL COPYRIGHT INFORMATION:
http://www.ieee.org/web/publications/rights/policies.html
http://www.ieee.org/portal/cms_docs_iportals/iportals/publications/rights/downloads/IEEECForm121302pdf.pdf
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Publisher URL:
http://dx.doi.org/10.1109/ISEMC.2008.4652123
Link to this page:
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titleThe influence of test parameters on TEM cell measurements of ICs
contributor.authorKasturi, Vijay
contributor.authorBeetner, Daryl G.
contributor.deptlabElectrical and Computer Engineering
contributor.deptlabElectromagnetic Compatibility Laboratory
subjectTEM-cell method
subjectemissions
subject.LCSHElectromagnetic compatibility.
subject.LCSHIntegrated circuits.
subject.LCSHTesting.
date.issued2008-08
publisherInstitute of Electrical and Electronics Engineers IEEE
identifier.citationKasturi, Vijay and Beetner, Daryl, "The influence of test parameters on TEM cell measurements of ICs." IEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008 (Aug. 2008): 1 - 6.
identifier.pub.URI
http://dx.doi.org/10.1109/ISEMC.2008.4652123
description.abstractThe IEC 61967-2 TEM cell standard allows for variations in test parameters which may cause variations in the measured emissions from integrated circuits (ICs). To test the impact of these parameters, two printed circuit boards were designed within the IEC standard using “poor” PCB design strategies and using “good” design strategies. Emissions from three pin-for-pin compatible 8051 microcontrollers were tested. Emissions were measured using both PCBs, changing the PCB configuration, and changing test parameters like the program running on the IC, the rise time of the input clock, and I/O switching. Emissions from the “poor” PCB were about 3–8 dB higher than emissions from the “good” PCB. A change in the program run by the IC, the clock rise-time, and I/O caused a 4–15 dB change in emissions. Emissions differed considerably among the ICs. Possible causes for variations in emissions with the test parameters are discussed.
typeArticle - Conference proceedings
type.DCMITypetext
type.statusFinal version
relation.isPartOfIEEE International Symposium on Electromagnetic Compatibility, 2008. EMC 2008.
rightsThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
rightscan upload final version
rights.URI
http://www.ieee.org/web/publications/rights/policies.html
rights.URI
http://www.ieee.org/portal/cms_docs_iportals/iportals/publications/rights/downloads/IEEECForm121302pdf.pdf
rights.URI
http://www.ieee.org/web/publications/rights/index.html
date.accessioned2008-12-02T19:00:03Z
identifier.persist.URI
http://scholarsmine.mst.edu/post_prints/TheInfluenceOfTestParametersOnTEMCellMeasure_09007dcc805b9f9d.html
date.available2008-12-02T22:08:21Z
Full Text
theinfluence_09007dcc805b9fef.pdf