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Title: Disbond thickness evaluation employing multiple-frequency near-field microwave measurements
Author (s): Abou-Khousa, Mohamed
Zoughi, Reza
Department/Lab Affiliations: Applied Microwave Nondestructive Testing Laboratory
Electrical and Computer Engineering
University Transportation Center
Keywords: maximum likelihood (ML)
multiple frequency measurements
nondestructive evaluation (NDE)
thickness estimation
Issue Date: 2007
Publisher: Institute of Electrical and Electronics Engineers IEEE
Citation: Abou-Khousa, M. and Zoughi, R. “Disbond Thickness Evaluation Employing Multiple-Frequency Near-Field Microwave Measurements,” IEEE Transactions on Instrumentation and Measurement, vol. 56, no. 4, pp. 1107-1113, 2007.
Abstract: Near-field microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multilayer dielectric composite structures. The high detection capability associated with these techniques stems from the fact that near-field microwave signals are sensitive to minute variations in the dielectric properties and geometry of the medium in which they propagate. In the past, the sensitivity of the near-field microwave NDE techniques to the presence and properties of disbonds in multilayer dielectric composites has been investigated extensively. However, a quantitative disbond thickness estimation method has yet to be introduced. In this paper, we propose a maximum-likelihood (ML) disbond thickness evaluation method utilizing multiple independent measurements obtained at different frequencies. We also introduce a statistical lower limit on the thickness resolution based on the mean-squared error in thickness estimation and a given confidence interval. The effectiveness of the proposed ML method is also verified by comparing simulation results with actual measurements.
Type: Article - Journal
text
In Title: IEEE Transactions on Instrumentation and Measurement
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Publisher URL:
http://dx.doi.org/10.1109/TIM.2007.899848
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titleDisbond thickness evaluation employing multiple-frequency near-field microwave measurements
contributor.authorAbou-Khousa, Mohamed
contributor.authorZoughi, Reza
contributor.deptlabApplied Microwave Nondestructive Testing Laboratory
contributor.deptlabElectrical and Computer Engineering
contributor.deptlabUniversity Transportation Center
contributor.sponsorAir Force Research Lab
subjectmaximum likelihood (ML)
subjectmultiple frequency measurements
subjectnondestructive evaluation (NDE)
subjectthickness estimation
date.issued2007
publisherInstitute of Electrical and Electronics Engineers IEEE
identifier.citationAbou-Khousa, M. and Zoughi, R. “Disbond Thickness Evaluation Employing Multiple-Frequency Near-Field Microwave Measurements,” IEEE Transactions on Instrumentation and Measurement, vol. 56, no. 4, pp. 1107-1113, 2007.
identifier.pub.URI
http://dx.doi.org/10.1109/TIM.2007.899848
description.abstractNear-field microwave nondestructive evaluation (NDE) techniques have shown great potential for disbond detection in multilayer dielectric composite structures. The high detection capability associated with these techniques stems from the fact that near-field microwave signals are sensitive to minute variations in the dielectric properties and geometry of the medium in which they propagate. In the past, the sensitivity of the near-field microwave NDE techniques to the presence and properties of disbonds in multilayer dielectric composites has been investigated extensively. However, a quantitative disbond thickness estimation method has yet to be introduced. In this paper, we propose a maximum-likelihood (ML) disbond thickness evaluation method utilizing multiple independent measurements obtained at different frequencies. We also introduce a statistical lower limit on the thickness resolution based on the mean-squared error in thickness estimation and a given confidence interval. The effectiveness of the proposed ML method is also verified by comparing simulation results with actual measurements.
typeArticle - Journal
type.DCMITypetext
type.statusFinal version
rightsThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
rightsallows publisher's final version to be uploaded
rights.URI
http://www.ieee.org/web/publications/rights/policies.html
rights.URI
http://www.ieee.org/portal/cms_docs_iportals/iportals/publications/rights/downloads/IEEECForm121302pdf.pdf
rights.URI
http://www.ieee.org/web/publications/rights/index.html
relation.isPartOfIEEE Transactions on Instrumentation and Measurement
date.accessioned2008-07-28T19:03:16Z
date.available2008-08-04T19:39:18Z
identifier.persist.URI
http://scholarsmine.mst.edu/post_prints/DisbondThicknessEvaluationEmployingMultiple-Fre_09007dcc80543b3d.html
Full Text
DisbondThicknessEvaluation_09007dcc80543c19.pdf