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| Title: | Cure kinetics and rheology characterization of soy-based epoxy resin system |
| Author (s): | Liang, G. Chandrashekhara, K. |
| Department/Lab Affiliations: | Center for Environmental Science and Technology (CEST) Center for Infrastructure Engineering Studies Intelligent Systems Center Mechanical & Aerospace Engineering University Transportation Center |
| Keywords: | cure kinetics neural network rheology soy-based resin |
| Issue Date: | 2006 |
| Publisher: | John Wiley & Sons |
| Citation: | G. Liang and K. Chandrashekhara, “Cure Kinetics and Rheology Characterization of Soy-based Epoxy Resin System,” Journal of Applied Polymer Science,Vol. 102, pp. 3168-3180, 2006. |
| Abstract: | A novel soy-based epoxy resin system was synthesized by the process of transesterification and epoxidation of regular soy bean oil, which has the potential to be widely usable in various composite manufacturing processes. Cure kinetics and rheology are two chemical properties commonly required in process modeling. In this work, the cure kinetics and rheology of the soy-based resin system were measured by means of differential scanning calorimetry (DSC) and viscometer. DSC was used to measure the heat flow of dynamic and isothermal curing processes. The cure kinetics models of the different formulations were thus developed. A Brookfield viscometer was used to measure the change in viscosity under isothermal conditions. A novel neural network-based model was developed to improve modeling accuracy. The models developed for cure kinetics and rheology for soy-based epoxy resin system can be readily applied to composite processing. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3168-3180, 2006 |
| Type: | Article - Journal text |
| In Title: | Journal of Applied Polymer Science |
| Copyright Notice: | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. FULL COPYRIGHT INFORMATION: |
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| title | Cure kinetics and rheology characterization of soy-based epoxy resin system |
| contributor.author | Liang, G. |
| contributor.author | Chandrashekhara, K. |
| contributor.deptlab | Center for Environmental Science and Technology (CEST) |
| contributor.deptlab | Center for Infrastructure Engineering Studies |
| contributor.deptlab | Intelligent Systems Center |
| contributor.deptlab | Mechanical & Aerospace Engineering |
| contributor.deptlab | University Transportation Center |
| subject | cure kinetics |
| subject | neural network |
| subject | rheology |
| subject | soy-based resin |
| date.issued | 2006 |
| publisher | John Wiley & Sons |
| identifier.citation | G. Liang and K. Chandrashekhara, “Cure Kinetics and Rheology Characterization of Soy-based Epoxy Resin System,” Journal of Applied Polymer Science,Vol. 102, pp. 3168-3180, 2006. |
| identifier.pub.URI | |
| description.abstract | A novel soy-based epoxy resin system was synthesized by the process of transesterification and epoxidation of regular soy bean oil, which has the potential to be widely usable in various composite manufacturing processes. Cure kinetics and rheology are two chemical properties commonly required in process modeling. In this work, the cure kinetics and rheology of the soy-based resin system were measured by means of differential scanning calorimetry (DSC) and viscometer. DSC was used to measure the heat flow of dynamic and isothermal curing processes. The cure kinetics models of the different formulations were thus developed. A Brookfield viscometer was used to measure the change in viscosity under isothermal conditions. A novel neural network-based model was developed to improve modeling accuracy. The models developed for cure kinetics and rheology for soy-based epoxy resin system can be readily applied to composite processing. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3168-3180, 2006 |
| type | Article - Journal |
| type.DCMIType | text |
| type.status | Postprint |
| rights | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. |
| rights.URI | |
| relation.isPartOf | Journal of Applied Polymer Science |
| date.accessioned | 2007-04-11T17:00:48Z |
| date.available | 2008-05-06T18:25:20Z |
| identifier.persist.URI |