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| Title: | Characterizing the electric field coupling from IC heatsink structures to external cables using TEM cell measurements | |
| Author (s): | Deng, Shaowei Hubing, Todd H. Beetner, Daryl G. | |
| Department/Lab Affiliations: | Electrical and Computer Engineering Electromagnetic Compatibility Laboratory | |
| Keywords: | closed-form equation mutual capacitance radiated emissions self-capacitance transverse electromagnetic (TEM) cell | |
| Issue Date: | 2007 | |
| Publisher: | Institute of Electrical and Electronics Engineers IEEE | |
| Citation: | Deng, Shaowei, Todd Hubing, and Daryl G. Beetner. "Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables Using TEM Cell Measurements", IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 4, pp. 785-791, 2007. | |
| Abstract: | One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involves mounting the IC on a printed circuit board (PCB) embedded in the wall of a transverse electromagnetic (TEM) cell. The signal voltages on the IC and its package produce electric fields that can couple to cables and other structures attached to the PCB, inducing common-mode currents that can be a primary source of unintentional radiated emissions. The signal currents in the IC and its package produce magnetic fields that can also result in common-mode currents on larger radiating structures. This paper describes a TEM cell measurement method employing a hybrid to separate the electric field coupling and the magnetic field coupling. The results of this measurement can be used to determine the product of the IC's self-capacitance and the effective voltage that drives this capacitance. This voltage-capacitance product characterizes the IC's ability to drive common-mode currents onto cables or enclosures due to electric field coupling. This information can then be used to estimate the resulting radiated emissions. | |
| Type: | Article - Journal text | |
| In Title: | IEEE Transactions on Electromagnetic Compatibility | |
| Copyright Notice: | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. allows publisher's final version to be uploaded FULL COPYRIGHT INFORMATION: | |
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| title | Characterizing the electric field coupling from IC heatsink structures to external cables using TEM cell measurements | |
| contributor.author | Deng, Shaowei | |
| contributor.author | Hubing, Todd H. | |
| contributor.author | Beetner, Daryl G. | |
| contributor.deptlab | Electrical and Computer Engineering | |
| contributor.deptlab | Electromagnetic Compatibility Laboratory | |
| subject | closed-form equation | |
| subject | mutual capacitance | |
| subject | radiated emissions | |
| subject | self-capacitance | |
| subject | transverse electromagnetic (TEM) cell | |
| date.issued | 2007 | |
| publisher | Institute of Electrical and Electronics Engineers IEEE | |
| identifier.citation | Deng, Shaowei, Todd Hubing, and Daryl G. Beetner. "Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables Using TEM Cell Measurements", IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 4, pp. 785-791, 2007. | |
| identifier.pub.URI | ||
| description.abstract | One method for evaluating the unintentional radiated emissions from integrated circuits (ICs) involves mounting the IC on a printed circuit board (PCB) embedded in the wall of a transverse electromagnetic (TEM) cell. The signal voltages on the IC and its package produce electric fields that can couple to cables and other structures attached to the PCB, inducing common-mode currents that can be a primary source of unintentional radiated emissions. The signal currents in the IC and its package produce magnetic fields that can also result in common-mode currents on larger radiating structures. This paper describes a TEM cell measurement method employing a hybrid to separate the electric field coupling and the magnetic field coupling. The results of this measurement can be used to determine the product of the IC's self-capacitance and the effective voltage that drives this capacitance. This voltage-capacitance product characterizes the IC's ability to drive common-mode currents onto cables or enclosures due to electric field coupling. This information can then be used to estimate the resulting radiated emissions. | |
| type | Article - Journal | |
| type.DCMIType | text | |
| type.status | Final version | |
| rights | This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | |
| rights | allows publisher's final version to be uploaded | |
| rights.URI | ||
| rights.URI | ||
| rights.URI | ||
| relation.isPartOf | IEEE Transactions on Electromagnetic Compatibility | |
| date.accessioned | 2008-06-23T20:12:18Z | |
| date.available | 2008-06-27T19:15:34Z | |
| identifier.persist.URI | ||
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