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Title: Analysis of chip-level EMI using near-field magnetic scanning
Author (s): Dong, X.
Deng, S.
Hubing, Todd H.
Beetner, Daryl G.
Department/Lab Affiliations: Electrical and Computer Engineering
Electromagnetic Compatibility Laboratory
Keywords: FPGA
IC packages
chip-level EMI analysis
clock driver
current distribution
electric current measurement
electric noise measurement
electromagnetic compatibility
electromagnetic interference
field programmable gate array
high-frequency noise currents
integrated circuit noise
integrated circuit testing
integrated circuits
magnetic field measurement
memory module
near-field magnetic scanning
printed circuit board
radiated emissions
radiated energy
unintentional radiating structures
Issue Date: 2004
Publisher: Institute of Electrical and Electronics Engineers
Citation: Dong, X.; Deng, S.; Hubing, T.; Beetner, D., "Analysis of chip-level EMI using near-field magnetic scanning," 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, vol.1, pp. 174- 177, 9-13 Aug. 2004
Abstract: Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Well designed ICs maintain good control of the currents that they generate. However, poorly designed ICs can drive high-frequency noise currents onto nominally low-frequency input and output pins. These currents can excite unintentional radiating structures on the printed circuit board, resulting in radiated emissions that are difficult or expensive to control. The paper discusses the use of magnetic near-field scanning techniques to measure the current distribution in IC packages. This technique is applied to common ICs, including a clock driver, a memory module and a field programmable gate array (FPGA). Results show that near-field magnetic scanning is an effective tool for investigating chip-level EMI problems.
Type: Article - Conference proceedings
text
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titleAnalysis of chip-level EMI using near-field magnetic scanning
contributor.authorDong, X.
contributor.authorDeng, S.
contributor.authorHubing, Todd H.
contributor.authorBeetner, Daryl G.
contributor.deptlabElectrical and Computer Engineering
contributor.deptlabElectromagnetic Compatibility Laboratory
subjectFPGA
subjectIC packages
subjectchip-level EMI analysis
subjectclock driver
subjectcurrent distribution
subjectelectric current measurement
subjectelectric noise measurement
subjectelectromagnetic compatibility
subjectelectromagnetic interference
subjectfield programmable gate array
subjecthigh-frequency noise currents
subjectintegrated circuit noise
subjectintegrated circuit testing
subjectintegrated circuits
subjectmagnetic field measurement
subjectmemory module
subjectnear-field magnetic scanning
subjectprinted circuit board
subjectradiated emissions
subjectradiated energy
subjectunintentional radiating structures
date.issued2004
date.submitted2007
publisherInstitute of Electrical and Electronics Engineers
identifier.citationDong, X.; Deng, S.; Hubing, T.; Beetner, D., "Analysis of chip-level EMI using near-field magnetic scanning," 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, vol.1, pp. 174- 177, 9-13 Aug. 2004
identifier.pub.URI
http://ieeexplore.ieee.org/iel5/9324/29635/01350020.pdf?arnumber=135002
description.abstractIntegrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Well designed ICs maintain good control of the currents that they generate. However, poorly designed ICs can drive high-frequency noise currents onto nominally low-frequency input and output pins. These currents can excite unintentional radiating structures on the printed circuit board, resulting in radiated emissions that are difficult or expensive to control. The paper discusses the use of magnetic near-field scanning techniques to measure the current distribution in IC packages. This technique is applied to common ICs, including a clock driver, a memory module and a field programmable gate array (FPGA). Results show that near-field magnetic scanning is an effective tool for investigating chip-level EMI problems.
typeArticle - Conference proceedings
type.DCMITypetext
type.statusFinal version
rightsThis material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.
rights.URI
http://www.ieee.org/web/publications/rights/policies.html
date.accessioned2007-04-05T14:21:19Z
date.available2007-04-05T14:21:19Z
identifier.persist.URI
http://scholarsmine.mst.edu/post_prints/01350020_09007dcc8030d386.html
Full Text
01350020_09007dcc8030d38b.pdf