Initial Investigation on the Use of Waterjets to Place Amendments in the Subsurface
Quasi-passive in situ remediation technologies, such as the use of permeable reactive barriers to treat contaminated groundwater or applications of granular activated carbon to treat polychlorinated biphenyl (PCB)-contaminated, near-surface sediments, are proven or promising technologies that may be limited in application due to the traditional construction techniques normally used for placement in the environment. High-pressure waterjets have traditionally been used to excavate material during mining operations or to cut rock or other durable material. Waterjets have the potential to place amendments in the subsurface at depths greater than those that can be obtained using traditional construction techniques. Likewise, waterjets may have less negative impact on near-surface utilities and/or sensitive ecological systems. Laboratory experiments were performed to characterize the placement of two solid amendments in a simulated saturated aquifer. a second set of experiments was performed to characterize the effectiveness of waterjets for placing a third amendment in simulated intertidal sediments. the laboratory work focused on characterizing the nature of the waterjet penetration of the aquifer matrix and the saturated sediments, as well as the corresponding waterjet parameters of pressure, nozzle size, and injection time. the laboratory results suggest that field trials may be appropriate for future investigations.
J. W. Cable et al., "Initial Investigation on the Use of Waterjets to Place Amendments in the Subsurface," Remediation Journal, vol. 16, no. 1, pp. 43-54, Wiley Periodicals Inc., Dec 2005.
The definitive version is available at https://doi.org/10.1002/rem.20069
Mining and Nuclear Engineering
Geosciences and Geological and Petroleum Engineering
Keywords and Phrases
Initial Investigation; Quasi-Passive; Permeable Reactive Barriers; Polychlorinated Biphenyl (PCB); Simulated Saturated Aquifer; Subsurface; Waterjets
International Standard Serial Number (ISSN)
Article - Journal
© 2005 Wiley Periodicals, Inc., All rights reserved.