Abstract
Adhesion of a pre-stressed silicone rubber film to a planar graphite surface was investigated by a new cylindrical punch method. a homemade apparatus was constructed to meet force and displacement resolutions of 0.1 μN and 10 nm. When the punch approached the intersurface force range across the punch-film gap, the film jumped into contact at "pull-in". Upon unloading, once the tensile load reached a threshold, a spontaneous delamination occurred at "pull-off" with a non-zero contact circle. a theoretical model was constructed based a simple energy balance. the new method can be used to characterize an adhesion interface between a pre-stressed free-hanging film and a rigid substrate. © 2006 Elsevier Ltd. All rights reserved.
Recommended Citation
B. F. Ju et al., "A Novel Cylindrical Punch Method to Characterize Interfacial Adhesion and Residual Stress of a Thin Polymer Film," Engineering Fracture Mechanics, vol. 74, no. 7, pp. 1101 - 1106, Elsevier, May 2007.
The definitive version is available at https://doi.org/10.1016/j.engfracmech.2006.12.010
Department(s)
Mechanical and Aerospace Engineering
Keywords and Phrases
Adhesion; Contact mechanics; Delamination; Interface; Surface forces; Thin film
International Standard Serial Number (ISSN)
0013-7944
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Elsevier, All rights reserved.
Publication Date
01 May 2007
Comments
National Science Foundation, Grant 0757140