Title

Surface Roughness Optimization in Processing SiC Monocrystal Wafers by Wire Saw Machining with Ultrasonic Vibration

Department(s)

Mechanical and Aerospace Engineering

International Standard Serial Number (ISSN)

0954-4054

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2014 SAGE Publications, All rights reserved.

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