Surface Roughness Optimization in Processing SiC Monocrystal Wafers by Wire Saw Machining with Ultrasonic Vibration
B. Wan et al., "Surface Roughness Optimization in Processing SiC Monocrystal Wafers by Wire Saw Machining with Ultrasonic Vibration," Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, vol. 228, no. 5, pp. 725-739, SAGE Publications, May 2014.
The definitive version is available at http://dx.doi.org/10.1177/0954405413508116
Mechanical and Aerospace Engineering
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