Femtosecond Laser-Induced Silicon Surface Morphology in Water

Author

Y. Han
C.-H. Lin
Hai-Lung Tsai, Missouri University of Science and TechnologyFollow

Abstract

This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micromachining surface quality in industrial applications. Copyright © 2008 by ASME.

Recommended Citation

Y. Han et al., "Femtosecond Laser-Induced Silicon Surface Morphology in Water," ASME International Mechanical Engineering Congress and Exposition, Proceedings, American Society of Mechanical Engineers (ASME), Jan 2009.

The definitive version is available at https://doi.org/10.1115/IMECE2008-67923

Meeting Name

2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008

Department(s)

Mechanical and Aerospace Engineering

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2009 American Society of Mechanical Engineers (ASME), All rights reserved.

Publication Date

01 Jan 2009