Femtosecond Laser Fabrication of Lab-On-A-Chip in Glass for Enhancing Detection Sensitivity
Lab-on-a-chip devices offer faster, cheaper, and better ways of doing chemical and biological analyses. In this paper, we will show that both 3D micro-fluidic and 3D micro-optical structures can be directly formed in photosensitive glass using a femtosecond laser and an annealing and etching process. Particularly, we will demonstrate the fabrication and examine the function of lab-on-a-chip biosensors integrated with micro-optical loops for enhancing detection sensitivity. The fabricated lab-on-a-chip biosensors are composed of a micro-fluidic channel into which sample under test will be injected. Five micro-optical mirrors are distributed on both sides of the micro-channel to form a zigzag optical path, which forces a micro-optical beam to cross the micro-fluidic channel three times before entering into a photodetector. This design can effectively extend the absorption path length and result in enhanced detection sensitivity of photoabsorption spectroscopic analysis. To examine the function of the micro-device, we filled the microfluidic channel with a dye solution (Rhodamine 640 dissolved in methanol) and shone a green laser beam (532nm) from a laser pointer into the microstructure. The fluorescence emission from the dye solution indicated that the light beam passed through the microchannel; however, due to the strong absorption, the output beam was not obvious. Quantitative characterization is under way for evaluating the detection limit of the labon-a-chip micro-device. Copyright © 2006 by ASME.
Y. Cheng et al., "Femtosecond Laser Fabrication of Lab-On-A-Chip in Glass for Enhancing Detection Sensitivity," American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, American Society of Mechanical Engineers (ASME), Jan 2006.
The definitive version is available at http://dx.doi.org/10.1115/IMECE2006-16016
2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Mechanical and Aerospace Engineering
Article - Conference proceedings
© 2006 American Society of Mechanical Engineers (ASME), All rights reserved.